At the rack scale level, KAYTUS has introduced a rack scale server compatible with select OCP open standards, designed to ...

Taiwan Semiconductor is expanding its chip-on-wafer-on-substrate (CoWoS) capacity at a rapid pace to accommodate added AI-graphics processing unit (GPU) production. CoWoS packaging is necessary for ...

Scientists and engineers now have a way to produce high frequency arbitrary waveforms, with high purity and low distortion, ...

A new ultraportable notebook from HP with the AMD Ryzen AI 300 "Strix Point" processor, set for release this December, ...

Nvidia has asked SK hynix to move up its delivery timeline for next-generation HBM4 memory chips by six months, according to ...

Samsung Electronics is betting on Processing-in-Memory (PIM) as the next-generation memory chip for artificial intelligence ...

Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen ...

The memory technology market has experienced significant fluctuations in recent years, marked by production cuts and shifting prices. The beginning of 2024 saw a gradual recovery, driven by rising ...

Nvidia is urging SK Hynix to fast-track the production of its high-bandwidth memory (HBM4) chips as demand for AI hardware ...

SK Group Chair Chey Tae-won said Nvidia CEO Jensen Huang asked him if SK Hynix could move the supply of high-bandwith memory ...

Chinese authorities are expected to announce more details on fiscal support when the country’s highly anticipated parliament ...

The head of AI computing giant Nvidia asked South Korea's SK hynix to speed up delivery of newer, more advanced HBM4 chips by six months, the head of SK Group said Monday.