A new ultraportable notebook from HP with the AMD Ryzen AI 300 "Strix Point" processor, set for release this December, ...
As artificial intelligence (AI) applications expand, the demand for high-bandwidth memory (HBM) has surged. South Korean ...
Samsung Electronics’ semiconductor chief, Jun Young-hyun, head of the Device Solutions (DS) division, recently launched a ...
Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...
The memory technology market has experienced significant fluctuations in recent years, marked by production cuts and shifting prices. The beginning of 2024 saw a gradual recovery, driven by rising ...
High-Bandwidth Memory 5 is intended to further increase the number of memory layers. This requires modern stacking technology ...
Samsung declared progress in supplying AI memory chips to Nvidia Corp., seeking to reassure to investors who fear the company ...
SK Hynix has posted record revenues for Q3 2024, with its operating profit jumping 28.6 percent from the previous to hit $5.1 ...
SK Hynix recently posted a record 7.03 trillion won in profit, intensifying pressure on Samsung in a rapidly evolving memory chip market.
Samsung Electronics is betting on Processing-in-Memory (PIM) as the next-generation memory chip for artificial intelligence ...