Samsung Electronics is betting on Processing-in-Memory (PIM) as the next-generation memory chip for artificial intelligence ...
As artificial intelligence (AI) applications expand, the demand for high-bandwidth memory (HBM) has surged. South Korean ...
Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...
High-Bandwidth Memory 5 is intended to further increase the number of memory layers. This requires modern stacking technology ...
Samsung declared progress in supplying AI memory chips to Nvidia Corp., seeking to reassure to investors who fear the company ...
SK Hynix has posted record revenues for Q3 2024, with its operating profit jumping 28.6 percent from the previous to hit $5.1 ...
Samsung Electronics said it would focus on producing high-end chips to improve profitability after reporting a 40 per cent ...
Samsung Electronics’ semiconductor chief, Jun Young-hyun, head of the Device Solutions (DS) division, recently launched a ...